Cooling Silicone Interface Pad: HWP-120

Product Item：HWP-120

Thermally Conductive Silicone Interface Pad Mat Sheets

Silicone Interface Heat Transfer Pad Mat Sheets

Silicone Interface Cooling Pad Mat Sheets

Silicone Interface Pad Mat Sheets Cooler

Description

Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad HWP120

Technical Data:

Product Features:

Thermal conductivity: 1.2W/m-K

Available in thickness from 0.020” – 0.200”
(0.5mm--5.0mm),0.010-inch(0.25mm) increments

Low compression set enables the pad to be reused

HWP-is a highly conformable, low modulus, low hardness filled-silicone polymer, at pressures of 50 psi, deflect 50% the original thickness, the material can be used as an interface where one side is in contact with a leaded device

Product Applications:

Telecommunication hardware

Memory modules

LED solid state lighting

Computer and peripherals

Power electronics

Automotive electronics

Handheld electronics

Graphics cards

Heat sink thermal model

Configurations Available and Options

Sheet form (18”X18”,18”X9”) and custom die-cut parts

A1 indicates only one side tacky

T1 indicates insulator liner option

Product description:

Typical Properties of HWP-120
Properties	Units	HWP120	Test Method
Construction & Composition	---	Silicone & Ceramic filled	---
Color	---	Light Blue	Visual
Thickness Range	mm	0.5~5.0mm	ASTM D374
Hardness	Shore 00	20	ASTM D2240
Density	g/cc	1.78	ASTM D792
Continuous Use Temp	℃	-60 to 160	EN344
Breakdown Voltage	Vac/mm	≥300	ASTM D149
Volume Impedance	ohm-cm	6*10¹⁶	ASTM D257
Dielectric Constant	1MHz	5.5	ASTM D150
Flame Rating	----	V-0	UL 94
Thermal Conductivity	W/m.k	1.2	ASTM D5470
UL, RoHS, REACH	----	Compliance	----