thermally conductive interface silicone pad HWP-150

thermally conductive interface silicone pad HWP-150

Product Item：HWP-150

Thermally Conductive Silicone Interface Pad Mat Sheets

Silicone Interface Heat Transfer Pad Mat Sheets

Silicone Interface Cooling Pad Mat Sheets

Silicone Interface Pad Mat Sheets Cooler

Description

Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad,thermally conductive interface silicone pad HWP-150

Technical Data:

thermally conductive interface silicone pad HWP-150

Product Features:

-Good thermal conductivity
-High conformability and cost effective
-Shock absorbing and naturally tacky
-Electrically insulating
-it is easy to fill in air gaps between PC board and heat sinks or a metal chassis

Product Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Product description:

Typical Properties of HWP150
Properties	Units	HWP150	Test Method
Construction & Composition	---	Silicone & Ceramic filled	---
Color	---	Dark Gray	Visual
Thickness Range	mm	0.5~12.0	---
Hardness	Shore C	25	ASTM D2240
Density	g/cc	2.5	ASTM D792
Tensile Strength	KN/m	0.5	ASTM D412
Elongation	%	70%	ASTM D412
Continuous Use Temp	℃	-40 to 150	EN344
Breakdown Voltage	Kv/mm	≥5.0	ASTM D149
Volume Impedance	ohm-cm	8.0*10¹⁵	ASTM D257
Dielectric Constant	1MHz	5.75	ASTM D150
Weight Daminify	---	≤0.3﹪	@150℃ 240H
Flame Rating	---	V-0	UL 94
Thermal Conductivity	W/m.k	1.5	ASTM D5470
UL, RoHS, REACH	---	Compliance	---

Sheet sizes:
Standard sheet size:200400mm and 330330mm；Custom Die-cut parts available；Available with or without PSA