Description
Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad,thermally conductive interface silicone pad,thermally conductive silicone gap filler,Heat Transfer Silicone Sink Pad: HWP-250
Technical Data:
Heat Transfer Silicone Sink Pad: HWP-250
Product Features:
-Good thermal conductivity
Product Applications:
- Between electronic components
such as Semiconductor, IC, CPU.MOS and heatsink.
Product description:
HWP-250 Heat Transfer Silicone Sink Pad is naturally tacky, requiring no adhesive coating to inhabit thermal performance, It can also be with a rubber-coated fiberglass carrier becoming one side tacky and no tacky on other side to allowing easy material handing and installation.
Percent Deflection Vs Pressure
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