产品描述
Thermally Conductive Silicone Interface Pad Mat Sheets,Silicone Interface Heat Transfer Pad Mat Sheets,Silicone Interface Pad Mat Sheets Cooler,Silicone Interface Cooling Pad Mat Sheets,Cooling Silicone Interface Pad,thermally conductive interface silicone pad HWP-150
Technical Data:
thermally conductive interface silicone pad HWP-150
Product Features:
-Good thermal conductivity
-High conformability and cost effective
-Shock absorbing and naturally tacky
-Electrically insulating
-it is easy to fill in air gaps between PC board and heat sinks or a metal
chassis
Product Applications:
- Between electronic components
such as Semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal module, in all applications where a metal housing is
used as heatsink.
Product description:
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Typical Properties of HWP150 |
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Properties |
Units |
HWP150 |
Test Method |
|
Construction & Composition |
--- |
Silicone & Ceramic filled |
--- |
|
Color |
--- |
Dark Gray |
Visual |
|
Thickness Range |
mm |
0.5~12.0 |
--- |
|
Hardness |
Shore C |
25 |
ASTM D2240 |
|
Density |
g/cc |
2.5 |
ASTM D792 |
|
Tensile Strength |
KN/m |
0.5 |
ASTM D412 |
|
Elongation |
% |
70% |
ASTM D412 |
|
Continuous Use Temp |
℃ |
-40 to 150 |
EN344 |
|
Breakdown Voltage |
Kv/mm |
≥5.0 |
ASTM D149 |
|
Volume Impedance |
ohm-cm |
8.0*1015 |
ASTM D257 |
|
Dielectric Constant |
1MHz |
5.75 |
ASTM D150 |
|
Weight Daminify |
--- |
≤0.3﹪ |
@150℃ 240H |
|
Flame Rating |
--- |
V-0 |
UL 94 |
|
Thermal Conductivity |
W/m.k |
1.5 |
ASTM D5470 |
|
UL, RoHS, REACH |
--- |
Compliance |
--- |
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Sheet sizes: |
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Standard sheet size:200*400mm and 330*330mm；Custom Die-cut parts available；Available with or without PSA |
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Percent Deflection Vs Pressure
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