Thermally Conductive Grease Compound: HWG-300

产品型号：HWG-300

Thermally Conductive Grease Compound

Thermal Conductive Silicone Grease Paste

Silicone Interface Cooling Grease Paste

Silicone Interface Pad Mat Sheets Cooler

产品描述

Thermally Conductive Grease Compound,CPU Chip Thermal Conductive Heat transfer Cooling Grease Paste Compound Cooler,Thermal Conductive Silicone Grease Paste, Silicone Interface Cooling Grease Paste, Silicone Interface Pad Mat Sheets Cooler,Heat Transfer silicone Grease Paste,closeup-of-cpu-chip-white-thermal-grease,Thermally Conductive Silicone Interface Grease Paste,thermally conductive silicone gap Grease Paste,Heat Transfer Silicone Sink Grease Paste,Thermally Conductive Grease Compound: HWG300

Technical Data:

Product Features:

High thermal conductivity of 3.0 w/(m·k)
-High conformability and cost effective
-Long reliability; Lowest thermal resistance
-Designed for easy application

Product Applications:

It is usually used as the thermal conductive medium in electronic components to reduce the heat resistant of the contact surface, consequently reduce the temperature of the electric component.

HWG300 therml grease compound is a thermally conductive grease compound designed for:

- Between CPU,high performance GPU,IGBT and heatsink
- Telecom device, Military,Motol control Led lighting etc
- Cooling Module, memory module, in all applications where lower thermal resistance is required

Product description:

Typical Properties of HWG300
Properties	Units	HWG300	Test Method
Color	---	Gray / pasty	Visual
Density	g/ml	2.85±0.1	ASTM D374
Continuous Use Temp	℃	-60 to 200	EN344
Breakdown Voltage	Kv/mm	5	ASTM D149
Volume Impedance	ohm-cm	1.7*10¹⁶	ASTM D257
Dielectric Constant	1KHz	0.4	ASTM D150
Flame Rating	---	V0	UL 94
Thermal Conductivity	W/m.k	3.0	ASTM D5470
Thermal Resistance @50psi	℃-in2/W	0.06	ASTM D5470
UL, RoHS	---	Compliance	---
REACH	---	Pending	---