Thermal Conductive Silicone Grease Paste HWG-500

Product Item：HWG-500

Thermally Conductive Grease Compound

Thermal Conductive Silicone Grease Paste

Silicone Interface Cooling Grease Paste

Silicone Interface Pad Mat Sheets Cooler

Description

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Technical Data:

Product Features:

-High thermal conductivity of 5.0 w/(m·k)
-High conformability and cost effective
-Long reliability; Lowest thermal resistance
-Designed for easy application

-High thermal performance and thoroughly wets out contact surfaces to get low thermal resistance.

-HWG500 is a silicone based material thermal grease for use in high performance CPUs and GPUs,

-HWG500 is screened stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. The excellent surface wetting results in low interface thermal resistance. Sliq3500 is available in 0.5kg,1.0kg,2.0kg and 10kg or custom packaged in syringes for automated applications

Product Applications:

It is usually used as the thermal conductive medium in electronic components to reduce the heat resistant of the contact surface, consequently reduce the temperature of the electric component.

HWG300 therml grease compound is a thermally conductive grease compound designed for:

- Between CPU,high performance GPU,IGBT and heatsink
- Telecom device, Military,Motol control Led lighting etc
- Cooling Module, memory module, in all applications where lower thermal resistance is required

- CPUs(Desktops.Notebooks.Servers)

- Graphic chips, DSP chips

- LED lighting

- Flip chip microprocessors

- IGBT module

Product description:

Typical Properties of HWG500
Properties	Units	HWG500	Test Method
Color	---	Gray / pasty	Visual
Density	g/ml	2.85±0.1	ASTM D374
Continuous Use Temp	℃	-60 to 200	EN344
Breakdown Voltage	Kv/mm	5	ASTM D149
Volume Impedance	ohm-cm	1.7*10¹⁶	ASTM D257
Dielectric Constant	1KHz	0.4	ASTM D150
Flame Rating	---	V0	UL 94
Thermal Conductivity	W/m.k	4.5	ASTM D5470
Thermal Resistance @50psi	℃-in2/W	0.06	ASTM D5470
UL, RoHS	---	Compliance	---
REACH	---	Pending	---