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HONEYWON SILICONE PRODUCTS CO.,LTD

Tel :86-752-8481591
Fax :86-752-5339129
Contact: Mark Zhang
Mobile: 8613316795265
MSN: firefly197915@hotmail.com
Skype: firefly197915
sales1honeywon@163.com
Address: Xiajiao,Huicheng District,Huizhou City,Guangdong Province, P.R.China
 


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  Your location:Thermally Conductive Silicone Pads & Fillers >> Thermal Conductive Gap Filler
<img src='/upfile/product/20111109070958.jpg' /> Product Name: Thermal Conductive Gap Filler
Catalog: Thermally Conductive Silicone Pads & Fillers
Specification:
Price:
Thermal Conductive Gap Filler Description Next Product:[ Thermally Conductive Silicone Pad ] Last Product:[ Thermally Conductive Insulator ]

Typical Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc

- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

Specification Sheet:

Typical Properties of  K200

Properties Units Metric Value Test Method
Construction & Composition  ---- Silicone & Ceramic filled ----
Color  ---- Dark Gray Visual
Thickness Range mm 0.5~6.0 ----
Hardness  Shore C 25 ASTM D2240
Density  g/cc 2.79 ASTM D792
Tensile Strength  KN/m 0.33 ASTM D412
Elongation  % 78% ASTM D412
Continuous Use Temp    -40 to 150 EN344
Breakdown Voltage  Kv/mm ≥6.0 ASTM D149
Volume Impedance ohm-cm 1.1*1016 ASTM D257
Dielectric Constant 1MHz 5.75 ASTM D150
Weight Daminify  ---- ≤0.3 @150 240H
Flame Rating ---- V-0 UL 94
Thermal Conductivity  W/m.k 2.0 ASTM E1461
UL, RoHS, REACH ---- Compliance

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Copyright: HONEYWON Silicone Products Co.,Ltd Tel:86-752-8481591 Fax:86-752-5339129 Contact:Mark.Zhang Mobile:86-13316795265 MSN:firefly197915@hotmail.com Skype:firefly197915