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HONEYWON SILICONE PRODUCTS CO.,LTD

Tel :86-752-8481591
Fax :86-752-5339129
Contact: Mark Zhang
Mobile: 8613316795265
MSN: firefly197915@hotmail.com
Skype: firefly197915
sales1honeywon@163.com
Address: Xiajiao,Huicheng District,Huizhou City,Guangdong Province, P.R.China
 


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  Your location:Thermally Conductive Silicone Pads & Fillers >> CPU Thermally Conductive Pad
<img src='/upfile/product/20111109080018.jpg' /> Product Name: CPU Thermally Conductive Pad
Catalog: Thermally Conductive Silicone Pads & Fillers
Specification:
Price:
CPU Thermally Conductive Pad Description Next Product:[ Thermally Conductive Insulator ] Last Product:[ Heat Transfer Pad ]

Typical Applications:

- Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc

- Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Specification Sheet:

 

Typical Properties of K250

Properties Units Metric Value Test Method
Construction & Composition  ---- Silicone & Ceramic filled ----
Color  ---- Light Yellow Visual
Thickness Range mm 0.5~5.0 ----
Hardness  Shore C 25 ASTM D2240
Density  g/cc 2.93 ASTM D792
Tensile Strength  KN/m 0.4 ASTM D412
Elongation  % 72% ASTM D412
Continuous Use Temp    -40 to 150 EN344
Breakdown Voltage  Kv/mm ≥5.0 ASTM D149
Volume Impedance ohm-cm 3.2*1016 ASTM D257
Dielectric Constant 1MHz 6.3 ASTM D150
Weight Daminify  ---- ≤0.5 @150 240H
Flame Rating ---- V-0 UL 94
Thermal Conductivity  W/m.k 2.5 ASTM E1461
UL, RoHS, REACH ---- Compliance ----

 

 

Copyright: HONEYWON Silicone Products Co.,Ltd Tel:86-752-8481591 Fax:86-752-5339129 Contact:Mark.Zhang Mobile:86-13316795265 MSN:firefly197915@hotmail.com Skype:firefly197915